The process is used for decoration acid copper plating, application wide, it not only can be plated on steel, but also can be obtained same excellent effect on plastic parts.
     It may be obtained fast mirror-bright and good leveling deposit in wide current range. Deposit has good ductility, low internal stress and good adhesion with nickel deposit is a ideal electro deposits. The brighteness is not noticeably reduce in low current zone under high tempera-ture of bath.
     Formular of process and use condi-tions:

1. Use method: The JC-35 (× 4) type of brightener is consist of JC-35 A (×4) , JC-35 B (×4) and JC-35 C (×4) for concentration solutions.
2. Before use, take 1 part concentration solution with 3 parts(1:3) water diluted to standard solution. The following formular and consumption book is based on standard solution.

1. Fast brightening and high fillness , brightness.
2. A mirror bright copper deposit can be obtained in wide current den-sity range. It also can be obtained deposit which has very high fillness and brightness.
3. The wide operate tempera-ture range, it can be obtained excell-ent deposit in 18-40℃.
4. High impurities tolerance, not easy to produce pinholes, spots and fogs.
5. Easily operate and maintain, low consumption of brightener.
6. Very high brightener stability, good compatibility. It can be mix used with all brightener.
7. Easily transformed bath.
8. Easy to operate and maintain. Wide material sources lead to cost-saving.

1. A mirror-bright copper deposit with leveling and excellent ductility can be obtained on steel parts, zinc die casting and plastic parts.
2. High current efficiency, fast brightening speed. Pinholes are hardly produced on deposit. Low internal stress and ductility.
3. Strong impurities tolerance. Little decomposition and long bath duration.
4. This process is a foam type. Except available for cathode moving, but also suitable for high recycling filter as well as strong air agitation.
5. Easily operate and maintain, wide material sources lead to cost-saving.

1. A mirror-bright copper deposit with high leveling ability and ductility can be obtained in 10-40℃ range.
2. Easily operate and maintain, wide material sources lead to cost-saving. High current efficiency of bath. It can be used to higher current densi-ty, fast depositing speed and high product efficiency.
3. This process is a low foam type, except available for cathode moving plating, also used to recycle filter as well as strong agitation.
4. This is a double solutions type bath, the performance is near foreign advanced level. Not need stripping film, middle price and high performance

KC-type additive for fast acid bright copper plating consists of many kinds chemicals such as Bis-(sodium sulfopropyl)-disulfide and H1 etc.

1. The copper deposit with mirror-bright and good ductility can be obtained from Cu. sulfate plating bath containing KC additive. It need not polish after Cu. plating, can be directly plated for bright nickel and chromium. It is advant-age for contin-uous and auto product of Cu,Ni,Cr for plating.
2. The copper plating process contain-ing KC-type additive has fast deposi-ting speed. It can be used to large current density but has high gloss on deposit surface. Product efficiency was large increased and product duration was shorted.

1. Good brightness. Full bright can be obtained in the pro-cess range.
2. Brittleness-free of deposit.
3. Current efficiency more than 85%.
4. The porosity low of deposit. Strong deep plating ability.
5. Process stability, easy to control and operate due to consumption stable.
6. It can be compatible with same type additives for the domestic and the foreign brightener.

Suitable for various parts, especial-ly the barrel and rack plating of co-mplex parts, table parts and Zn. die casting parts.

Variety: W-97 initiator for full bright cyanide copper plating